Operating Temperature |
-40 ~ 80℃ (see Derating Curve) |
MTBF |
Io=100%; Ta=25℃ per MIL-HDBK-217F; 1380K hrS |
EMC Emission |
EN 55032:2015+AC:2016, 47 CFR FCC Part 15 Subpart B, ICES-003 Issue7,
EN 61204-3:2000, EN 61000-6-3:2007+A1:2011+AC:2012, EN 61000-3-2:2019,
EN 61000-3-3:2013 |
Class B |
Safety Approvals |
Class II, IEC/EN/UL 62368-1 |
Dimension |
Blank (PCB mount)----
2.382x1.300x0.906 Inches (60.50x33.02x23.00 mm)
E (Encapsulated)-------
2.482x1.402x0.933 Inches (63.04x35.60x23.70 mm)
T (Wafer)-------------- 3.000x1.300x0.831 Inches (76.20x33.02x21.10 mm) |
Weight |
Blank (PCB mount)----- 35 grams
E (Encapsulated) --------95 grams
T (Wafer) ---------------36grams |