Operating Temperature |
-40 ~ 80℃ (see Derating Curve) |
MTBF |
Io=100%; Ta=25℃ per MIL-HDBK-217F; 700K hrS |
EMC Emission |
EN 55032:2015+A11:2020, 47 CFR FCC Part 15 Subpart B, ICES-003 Issue7,
EN 61204-3:2018, EN 61000-6-3:2021, EN 61000-6-4:2019
EN 61000-3-2:2019, EN 61000-3-3:2013+A1:2019 |
Class B |
Safety Approvals |
Class II, IEC/EN/UL 62368-1 |
Dimension |
Blank (PCB mount)----
3.00x1.50x1.100 Inches (76.2x38.1x27.94 mm)
E (Encapsulated)-------
3.10x1.60x1.134 Inches (78.8x40.7x28.80 mm)
T (Wafer)-------------- 3.00x1.50x1.000 Inches (76.2x38.1x25.40 mm) |
Weight |
Blank (PCB mount)----- 55 grams
E (Encapsulated) --------156 grams
T (Wafer) ---------------55 grams |